Based on the conductive carbon film, we have derived a series of wafer consumables. Includes wafer pads and CMP polishing pads. These are formulated and produced in-house by HAOUGER. Wafer spacer, also known as wafer spacer, is made of conductive and antistatic film material through hot pressing and die cutting. Various patterns, sizes and shapes can be customized, the finished products have excellent dimensional stability, and the appearance is neat and does not drop powder or dust. Wafer pads are divided into PE and PS materials, both of which can be embossed and plain. Among them, the material of the PS wafer pad is stiffer, which makes the robotic arm easier to grasp; the surface is smoother, with effectively reduces the adsorption of dust. The surface resistance of the wafer pad is 10E3-10E11 ohms, and the electrostatic discharge time less than 1 second, which can effectively avoid static electricity and external force damage in the front and rear of the wafer and during transportation.

The CMP polishing pad is made of PET composite carbon film synthesized by a special process. The surface of the finished product is smooth and flat, scratch-resi stant, acid-alkali solvent-resistant, and the permanent surface resistance value is less than 1K Ω and uniform and stable. It can be quickly polished during the polishing process. Disperse the accumulated powder. Compared with polishing pads made by traditional coating method, this product has a longer service life (2.5-5 times more durable).

Wafer consumables from HAOUGER are widely used by many semiconductor companies.